| 摘要 |
A wafer pressing apparatus of a polishing device is provided to apply a polishing process amount to a whole surface of a wafer by uniformly delivering pressure delivered to the wafer to a central part and an edge part of the wafer. A pressure applying unit supplies air pressure to a chamber(140). A pressing unit applies pressure to a wafer by using the air pressure. The pressing unit includes an expanding unit(110) capable of being selectively expanded by the air pressure. A template assembly(150) is adjacent to the expanding unit, and pressurizes the wafer by receiving an expanding force of the expanding unit. A fixing unit(160) fixes an edge part of the expanding unit.
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