发明名称 Method for fabrication of devices in a multi-layer structure
摘要 A method for fabricating devices in a multi-layer structure adapted for the formation of enhancement mode high electron mobility transistors, depletion mode high electron mobility transistors, and power high electron mobility transistors includes defining gate recesses in the structure. The structure has, on a substrate, a channel layer, spacer layer on the channel layer, a first Schottky layer, a second Schottky layer on the first Schottky layer, and a third Schottky layer on the second Schottky layer, and a contact layer on the third Schottky layer. Etch stops are defined intermediate the first and second Schottky layers, intermediate the second and third Schottky layers, and intermediate the third Schottky layer and the contact layer.
申请公布号 US7541232(B2) 申请公布日期 2009.06.02
申请号 US20070998072 申请日期 2007.11.28
申请人 LOCKHEED MARTIN CORPORATION 发明人 ROBINSON KEVIN L.;WITKOWSKI LARRY;KAO MING-YIH
分类号 H01L21/338;H01L21/461 主分类号 H01L21/338
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