| 摘要 |
The present invention relates to a method for exchanging a semiconductor chip of such a flip-chip module, and to a suitable flip-chip module and a device for performing the method. The flip-chip module comprises at least one semiconductor chip and a substrate. The semiconductor chip has contact pillars arranged at a surface approximately perpendicularly to the surface. It is connected by said contact pillars to contact locations of the substrate via a soldering connection. The end faces of the contact pillars completely cover the contact locations. This makes it possible to press the solder between the contact pillars and contact locations after renewed heating completely from the intermediate region between the contact locations and the contact pillars. This permits a renewed fixing of a further semiconductor chip. |
