APPARATUS FOR DEPOSITION THIN FILM ON SUBSTRATE USING PLASMA

摘要

A thin film depositing apparatus is provided to improve productivity by installing the electrode having a target role inside a plasma generation part and applying thin film deposition using sputtering effect on a vertical reactor. A thin film depositing apparatus comprises: a vertical process tube(100) in which thin film deposition is progressed; a boat(200) which is located inside the process tube, and in which a plurality of wafers are loaded; a gas supply member being located between the process tube and the boat and providing the process gas from outside to wafers; and a plasma generation member(330) being installed inside the gas supply member and making the process gas in plasma state. The plasma generation member comprises: a target(332) being installed in a plasma generation space and consisting of the sourced metal of the thin film evaporated in the wafers; and a power source(334) applying the necessary power on the target for the plasma generation.