| 摘要 |
A substrate cleaning apparatus is provided to shorten a process time by forming plasma in a side surface and a rear surface of a substrate at the same time. A substrate cleaning apparatus cleans a rear surface and a side surface of a substrate by generating plasma in the side surface and the rear surface of the substrate while gripping a top surface of the substrate. The substrate cleaning apparatus includes a vacuum chamber(10), an electrostatic chuck(20), a moving chuck(30), a top insulator(40), a substrate holder(50), a bottom insulator(60), a top gas supply path(80), and an RF application part(90). A lift pin(100) penetrates the moving chuck, is driven top and bottom, and receives the substrate from outside. A cooling medium is circulated inside the electrostatic chuck. A top cooling path(24) cools the electrostatic chuck.
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