METHOD AND APPARATUS FOR DRESSING POLISHING PAD, PROFILE MEASURING METHOD, SUBSTRATE POLISHING APPARATUS, AND SUBSTRATE POLISHING METHOD

摘要

A method and an apparatus for dressing a polishing pad, a profile measuring method, a substrate polishing apparatus, and a substrate polishing method are provided to dress a polishing pad on a polishing table by pressurizing a dresser about the polishing pad. A dresser(3) is repeatedly moved on a top surface of a polishing pad toward a radial direction of the polishing pad(4) in order to perform a dressing process on the polishing pad. A height of the top surface of the polishing pad in a preset point of one among a plurality of sections on a polishing surface is measured in the dressing process. The dresser is repeatedly moved in order to measure height of the top surface of the polishing pad in a whole section. The height of the top surface of the polishing pad is measured.