发明名称 Compliant pad wafer chuck
摘要 A platform is designed to support thin flat substrates, such as semiconductor wafers, during observation of characteristics of the substrates. The platform includes a rigid base having a top surface. A resilient pad is supported on the base and the pad has a top surface, at least a portion of which yieldingly supports a flat substrate placed thereon.
申请公布号 US7541826(B2) 申请公布日期 2009.06.02
申请号 US20050129537 申请日期 2005.05.13
申请人 KLA-TENCOR CORPORATION 发明人 KOLIOPOULOS CHRIS L.;BOSTON MATTHEW R.
分类号 G01R31/26 主分类号 G01R31/26
代理机构 代理人
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