LED PACKAGE, METHOD OF FABRICATING THE SAME, AND BACKLIGHT ASSEMBLY COMPRISING THE SAME

摘要

An LED package, a manufacturing method thereof, and a back light assembly including the same are provided to improve heat-proof and wet-proof properties and prevent separation of protection resin. An LED(Light Emitting Diode) package comprises a side(210), a mold(260), an electrode pattern(360), LED chips(420,430), and protection resin(600). In the mold, a receiving groove(250) including a floor side(220) is formed. The electrode pattern is formed in the floor side. The LED chips are mounted on the electrode pattern. The protection resin is filled in the receiving groove. One LED chip of the plural LED chips has a height bigger than a height of the other LED chip, and is mounted in a central part side of the floor side.