发明名称 |
Optimized mounting area circuit module system and method |
摘要 |
A flexible circuitry is populated with integrated circuitry (ICs) disposed along one or both of its major sides. Contacts are distributed along the flexible circuitry to provide connection between the module and an application environment. A rigid substrate is configured to provide space on one side where the populated flex is disposed while in some embodiments, heat management or cooling structures are arranged on one side of the module to mitigate thermal accumulation in the module. |
申请公布号 |
US7542297(B2) |
申请公布日期 |
2009.06.02 |
申请号 |
US20050255061 |
申请日期 |
2005.10.19 |
申请人 |
ENTORIAN TECHNOLOGIES, LP |
发明人 |
WEHRLY, JR. JAMES DOUGLAS;WOLFE MARK;GOODWIN PAUL |
分类号 |
H05K1/00 |
主分类号 |
H05K1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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