| 发明名称 |
Electronic circuit configuration having a printed circuit board thermally coupled to a heat sink |
| 摘要 |
In order to improve the heat dissipation capacity in an electronic circuit configuration with one or more printed circuit boards thermally coupled by one flat side to a heat sink having at least one coolant duct, the flat side immediately adjoins the coolant duct.
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| 申请公布号 |
US7542291(B2) |
申请公布日期 |
2009.06.02 |
| 申请号 |
US20070821154 |
申请日期 |
2007.06.22 |
| 申请人 |
SIEMENS VDO AUTOMOTIVE AKTIENGESELLSCHAFT |
发明人 |
KARRER VOLKER;LICHTINGER BERNHARD;MEHLER JOHANNES;RENKEN FOLKER;SCHUPP FLORIAN;SMIT ARNOUD |
| 分类号 |
H05K7/20 |
主分类号 |
H05K7/20 |
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代理人 |
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