发明名称 PHOTOSENSITIVE RESIN COMPOSITION FOR INTERLAYER INSULATION FILM
摘要 A photosensitive resin composition for an interlayer insulation film is provided to increase the insulation of an interlayer insulating film by using a specific structure of an alkali soluble resin component. A photosensitive resin composition for an interlayer insulation film comprises an alkali soluble resin component; a sensitizer; and a copolymer containing an acidic group-containing component, a crosslinking group-containing component and an alkoxysilyl group-containing component. The alkoxysilyl group-containing component is represented by chemical formula 1. In chemical formula 1, R4 is hydrogen atom or methyl; R5 is C1-5 alkylene group; R6, R7 and R8 which are identical or different represent C1-5 alkoxy or alkyl group; and at least one of R6, R7 and R8 is an alkoxy group.
申请公布号 KR20090055487(A) 申请公布日期 2009.06.02
申请号 KR20080117869 申请日期 2008.11.26
申请人 TOKYO OHKA KOGYO CO., LTD. 发明人 NAKAO TAKU;MIYAGI KEN;SUGIMOTO YASUAKI
分类号 G03F7/075 主分类号 G03F7/075
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