ELECTRICALLY CONDUCTIVE ADHESIVE COMPOSITIONS FOR DIE ADHESION HAVING ENHANCED MOISTURE RESISTANCE AND RELIABILITY

摘要

An electrically conductive adhesive composition for die bonding is provided to ensure excellent wet-proof property, viscosity and thixotropic property suitable for a semiconductor process, and excellent reliability. An electrically conductive adhesive composition for die bonding comprises an epoxy resin; a flexible epoxy resin of which both ends is bonded with a glycidyl group and which contains bisphenol; a hardener; and an electric conductive metal filler. The epoxy resin is epoxy resin having two or more glycidyl groups. The epoxy resin comprises a bisphenol A-type epoxy resin of chemical formula 1; a bisphenol F type epoxy resin of chemical formula 2; a trifunctional epoxy resin of chemical formula 3; a tetrafunctional epoxy of chemical formula 4; a bisphenol S-form epoxy resin of chemical formula 5; a naphthalene type epoxy resin of chemical formula 6; a tert-butyl-catechol epoxy resin of chemical formula 7; a phenol novolac type epoxy resin of chemical formula 8; cresol novolac epoxy resin; brominated bisphenol A novolac epoxy resin; and a hydrogenated brominated bisphenol A type epoxy resin of chemical formula 9.