STACK PACKAGE AND METHOD OF FABRICATING THE SAME

摘要

A stack package and a method for fabricating the same are provided to prevent the degradation of productivity of the whole stack package by omitting an additional patterning process for forming the rewiring by connecting a metal rewiring with a line width with a nano size between respective electrode terminals of the substrate and a pad for selecting each chip. A plurality of semiconductor chips(106,108,110,112) are stacked on a substrate(102) having an electrode terminal. Each semiconductor chip includes pads(106a,106b) for selecting a chip and a penetrating electrode is electrically connected by the penetrating electrode. One surface of the substrate including the semiconductor chip is sealed by an encapsulation material. The pads for selecting each chip of each stacked semiconductor chip is connected to the electrode terminal of the substrate by a metal rewiring(111) with a line width with a nano size formed along the edge of the semiconductor chip.