ZN-AL EUTECTOID-BASE ALLOY JOINING MATERIAL, METHOD FOR MANUFACTURING ZN-AL EUTECTOID-BASE ALLOY JOINING MATERIAL, JOINING METHOD USING ZN-AL EUTECTPOID-BASE ALLOY JOINING MATERIAL, AND SEMICONDUCTOR DEVICE USING ZN-AL EUTECTPOID-BASE ALLOY JOINING MATERIAL

摘要

PROBLEM TO BE SOLVED: To provide a Zn-Al eutectoid-base alloy joining material which is lead-free, has a high melting point, enables joining in a solid phase state, a method for manufacturing the same, a joining method, and a semiconductor device using the same. SOLUTION: The Zn-Al eutectoid-base alloy joining material comprises 17 to 30 wt.% Al-0 to 0.5 wt.% Cu-0 to 0.5 wt.% Mg-Zn, wherein an object is joined in the solid phase state by using a superplastic phenomenon. COPYRIGHT: (C)2009,JPO&INPIT