METHOD OF MANUFACTURING SEMICONDUCTOR APPARATUS

摘要

PROBLEM TO BE SOLVED: To quickly exfoliate an extremely thin chip adhered to an adhesive tape without generating a crack nor a nick. SOLUTION: An exchangeable head 111a of an oscillator 110 is brought into contact with a rear surface of an adhesive tape 4 attached with a plurality of semiconductor chips 1 divided from a semiconductor wafer. The chip 1 is exfoliated from the adhesive tape 4 by applying vertical oscillation whose frequency is 1 kHz-100 kHz and whose amplitude is 1-50μm. While the vertical oscillation is applied to the adhesive tape 4, horizontal direction tension is applied to the adhesive tape 4. COPYRIGHT: (C)2009,JPO&INPIT