| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat treating apparatus for a substrate, for which a running cost is reduced. SOLUTION: The substrate heat treating apparatus includes a heat treatment space for the substrate, an air supply means for supplying air into the heat treatment space, and an air discharge means for discharging the air from the heat treatment space. The air supply means includes a heating means and an air supply amount control means, the air discharge means includes an air discharge amount control means, and the air supply amount control means and the air discharge amount control means are connected with an air supply/discharge control means for monitoring a feed parameter corresponding to the feed amount of the substrates fed to the heat treatment space by a moving average and controlling an air supply amount and an air discharge amount. COPYRIGHT: (C)2009,JPO&INPIT |
