发明名称 SUBSTRATE PROCESSING APPARATUS AND METHOD
摘要 PROBLEM TO BE SOLVED: To provide a substrate processing apparatus improving cleaning efficiency. SOLUTION: The substrate processing apparatus includes a jet nozzle which injects processing liquid and dries a substrate. The jet nozzle emits processing liquid onto the substrate and also injects processing gas toward the processing liquid emitted from the jet nozzle while adjusting flow of the processing gas. Therefore, the substrate processing apparatus achieves the minimum droplet of the processing liquid, thereby improving cleaning efficiency and product yield. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009117826(A) 申请公布日期 2009.05.28
申请号 JP20080273123 申请日期 2008.10.23
申请人 SEMES CO LTD 发明人 KIM SEONG-SOO
分类号 H01L21/304;H01L21/027 主分类号 H01L21/304
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