发明名称 PRESS BONDING DEVICE, APPARATUS FOR MANUFACTURING FLAT PANEL DISPLAY AND FLAT PANEL DISPLAY
摘要 PROBLEM TO BE SOLVED: To simplify a press bonding mechanism and shorten a processing time, and to respond to boards in various panel sizes when an electronic-circuit part is mounted on the board. SOLUTION: The press bonding device has a first long-side press bonding mechanism 21 thermocompression-bonding a plurality of the electronic-circuit parts 2 loaded through ACFs 5 on the first long-side side L1 of the square-shaped panel board 1 to the panel board 1 and a first short-side press bonding mechanism 22 being arranged while being orthogonal to the first long-side press bonding mechanism 21 and thermocompression-bonding a plurality of the electronic-circuit parts 2 loaded through the ACFs 5 on the first short-side side S1 of the panel board 1 to the panel board 1. The first long-side press bonding mechanism 21 and short-side press bonding mechanism 22 conduct the other thermocompression bonding during one thermocompression bonding. In the panel board 1, the length of the first long-side press bonding mechanism 21 is configured in the length longer than the length of the longest long side, and the length of the first short-side press bonding mechanism 22 is configured in the length longer than the length of the longest short side. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009117704(A) 申请公布日期 2009.05.28
申请号 JP20070290853 申请日期 2007.11.08
申请人 HITACHI HIGH-TECHNOLOGIES CORP 发明人 ONOSHIRO ATSUSHI;YUDA KUNIO;KATAHO HIDEAKI;HIWATARI SHOTARO;ISHIZAWA YASUAKI;SUGIZAKI SHINJI
分类号 H01L21/60;G02F1/1345 主分类号 H01L21/60
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