发明名称 |
PRESS BONDING DEVICE, APPARATUS FOR MANUFACTURING FLAT PANEL DISPLAY AND FLAT PANEL DISPLAY |
摘要 |
PROBLEM TO BE SOLVED: To simplify a press bonding mechanism and shorten a processing time, and to respond to boards in various panel sizes when an electronic-circuit part is mounted on the board. SOLUTION: The press bonding device has a first long-side press bonding mechanism 21 thermocompression-bonding a plurality of the electronic-circuit parts 2 loaded through ACFs 5 on the first long-side side L1 of the square-shaped panel board 1 to the panel board 1 and a first short-side press bonding mechanism 22 being arranged while being orthogonal to the first long-side press bonding mechanism 21 and thermocompression-bonding a plurality of the electronic-circuit parts 2 loaded through the ACFs 5 on the first short-side side S1 of the panel board 1 to the panel board 1. The first long-side press bonding mechanism 21 and short-side press bonding mechanism 22 conduct the other thermocompression bonding during one thermocompression bonding. In the panel board 1, the length of the first long-side press bonding mechanism 21 is configured in the length longer than the length of the longest long side, and the length of the first short-side press bonding mechanism 22 is configured in the length longer than the length of the longest short side. COPYRIGHT: (C)2009,JPO&INPIT
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申请公布号 |
JP2009117704(A) |
申请公布日期 |
2009.05.28 |
申请号 |
JP20070290853 |
申请日期 |
2007.11.08 |
申请人 |
HITACHI HIGH-TECHNOLOGIES CORP |
发明人 |
ONOSHIRO ATSUSHI;YUDA KUNIO;KATAHO HIDEAKI;HIWATARI SHOTARO;ISHIZAWA YASUAKI;SUGIZAKI SHINJI |
分类号 |
H01L21/60;G02F1/1345 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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