| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate processing apparatus equipped with a clamp device which facilitates management of a clamp force and equalization of clamp force and can be made compact, and to provide a manufacturing method of a semiconductor device by the substrate processing apparatus. SOLUTION: The substrate processing apparatus includes: reactor vessels 4 and 11 which have an opening portion 16 for carrying a substrate 8 in and out and process the substrate inside; a cover body 17 which opens and closes the opening portion; a lock member 19 which is provided on the cover body or on the reactor vessels to rotate and reciprocally move and engages and disengages the cover body and reactor vessels with and from each other through the rotation and reciprocal movement; and a moving mechanism which allows the lock member to rotate and reciprocally move. COPYRIGHT: (C)2009,JPO&INPIT
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