| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of forming a wiring pattern which can finely and accurately form a micro wiring pattern, and to provide a method of manufacturing a wiring substrate using the same. SOLUTION: The method of forming a wiring pattern includes: a step to form an interlayer insulating layer 12; a step to make a via hole 12a in the interlayer insulating layer 12 wherein a wiring pattern 10 of a lower layer is exposed over the inner bottom; a step to cover the surface of the interlayer insulating layer with a resist layer 20 wherein the via hole 12a is formed; a step to expose and develop the resist layer 20 to form a wiring groove 20a; a step to cover the surface of the interlayer insulating layer including the inner surface of the wiring groove 20a and the via hole 12a with a seed layer 14; a step to form a plating conductor 15 on the surface of the interlayer insulating layer including the inside of the via hole and the wiring groove while using the seed layer as an electric-supply layer; a step to remove the plating conductor 15 adhered to the surface of the interlayer insulating layer by polishing; and a step to remove the resist layer 20 on the interlayer insulating layer 12. COPYRIGHT: (C)2009,JPO&INPIT
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