METHOD FOR THE PRECISION PROCESSING OF SUBSTRATES AND USE OF SAID METHOD,申请号WO2008EP01807-传众专利搜索

发明名称	METHOD FOR THE PRECISION PROCESSING OF SUBSTRATES AND USE OF SAID METHOD
摘要	The invention relates to a method for the precision processing of substrates, in particular for the microstructuring of thin layers, for the local introduction of doping agents and the local application of a metal seed layer, wherein a fluid-supported laser, which is to say a laser irradiation of a substrate that is covered in the regions to be processed by an appropriate reactive fluid is conducted.
申请公布号	WO2008107194(A3)	申请公布日期	2009.05.28
申请号	WO2008EP01807	申请日期	2008.03.06
申请人	FRAUNHOFER-GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V.;ALBERT-LUDWIGS-UNIVERSITAET FREIBURG;MAYER, KUNO;ALEMAN, MONICA;KRAY, DANIEL;GLUNZ, STEFAN;METTE, ANSGAR;PREU, RALF;GROHE, ANDREAS	发明人	MAYER, KUNO;ALEMAN, MONICA;KRAY, DANIEL;GLUNZ, STEFAN;METTE, ANSGAR;PREU, RALF;GROHE, ANDREAS
分类号	C23C18/16;C25D5/02;C25D7/12;H01L21/288;H01L21/311;H01L21/768;H01L31/0216;H01L31/18	主分类号	C23C18/16
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