POLISHING HEAD AND POLISHING APPARATUS

摘要

A polishing head (11) is composed of at least a substantially disc-like middle plate (12), and a rubber film (13) which covers at least a lower surface section and a side surface section of the middle plate. The polishing head has a space section (14) surrounded by the middle plate and the rubber film, and is configured to have pressure in the space section changed by a pressure adjusting mechanism (15). The polishing head holds the rear surface of a work (W) at a lower surface section of the rubber film, and polishes the surface of the work by sliding the surface of the work on a polishing cloth (22) adhered on a surface plate. In the polishing head, the middle plate and the rubber film are not in contact with each other at least entirely on a lower surface section of the middle plate, and a gap (14a) is provided. Thus, the rubber chuck system polishing head applies uniform polishing load to the entire work without being affected by rigidity and planarity of the middle plate.