PHOTOCURABLE RESIN COMPOSITION, ITS CURED PRODUCT PATTERN, AND PRINTED WIRING BOARD WITH THE CURED PRODUCT PATTERN

摘要

PROBLEM TO BE SOLVED: To provide an alkali-developable photocurable resin composition having high sensitivity and useful as a solder resist excellent in curability under exposure by direct drawing especially with laser light.

SOLUTION: The photocurable resin composition contains (A) a carboxylic acid-containing photosensitive resin containing a structure represented by general formula (I) and a structure represented by general formula (II), (B) a photopolymerization initiator, and (C) a compound containing two or more ethylenically unsaturated groups in a molecule.

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