发明名称 |
CHUCK TABLE MECHANISM OF POLISHING DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To provide a chuck table mechanism of a polishing device having a cooling mechanism capable of preventing a protective tape from being fused. SOLUTION: This chuck table mechanism of a polishing device for polishing a wafer W includes: a support base 100 having a communication passage 108 selectively connectable to a suction source or a cooling water supply source; a chuck table body 102 having a plurality of annular communication passages 112 and fitting recesses 103 connected to the communication passage and fixedly mounted on the support base; and a porous suction chuck 104 having a holding surface for holding the wafer. The chuck table body has a plurality of communication holes 118 allowing the annular communication passages to communicate with the fitting recesses. The width of each of the annular communication passages is twice the diameter of the communication hole or wider. COPYRIGHT: (C)2009,JPO&INPIT
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申请公布号 |
JP2009113145(A) |
申请公布日期 |
2009.05.28 |
申请号 |
JP20070288057 |
申请日期 |
2007.11.06 |
申请人 |
DISCO ABRASIVE SYST LTD |
发明人 |
SEKIYA KAZUMA;YAMANAKA SATOSHI |
分类号 |
B24B41/06;B24B7/22;H01L21/304 |
主分类号 |
B24B41/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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