SIGNAL DROP COMPENSATION AT EXTERNAL TERMINAL OF INTEGRATED CIRCUIT PACKAGE

摘要

Compensation is provided for signal drop in bond wires of an integrated circuit (integrated circuit) (110) while minimizing the number of external terminals in the integrated circuit package (120). A functional circuit provides an output signal (e.g., voltage) on a pad of the integrated circuit, which is connected to an external terminal (130) on the package via a bond wire (170). A second circuit contained in the integrated circuit determines the signal drop in the bond wire by examining a parameter (e.g., current) proportional to a strength of the output signal at or before the pad in a transmission path of the signal. Thus, additional external terminals to sense the signal strength at a point external to the integrated circuit to provide compensation for the drop may not be required.