| 摘要 |
<P>PROBLEM TO BE SOLVED: To form a potential on a support substrate without performing wire bonding or enlarging the size of a sensor chip, in an acceleration sensor device formed by laminating the sensor chip having a movable electrode and fixed electrodes on the support substrate, on a circuit chip through a bonding layer. <P>SOLUTION: This device is equipped with the sensor chip 100 having the movable electrode 24 displaceable in a horizontal direction to the substrate surface and the fixed electrodes 31, 41 facing to the movable electrode 24 on the support substrate 11, for detecting an acceleration based on a distance change between the movable electrode 24 and the fixed electrodes 31, 41 during application of the acceleration. In the device, the circuit chip 200 is bonded to the under side of the support substrate 11 of the sensor chip 100 through the electrically-insulating bonding layer 300, and a bonding layer non-existing domain 310 where the bonding layer 300 does not exist is provided in a domain where the sensor chip 100 is projected on the circuit chip 200, and the circuit chip 200 is electrically connected therein to the support substrate 11 through a conductive member 320. <P>COPYRIGHT: (C)2009,JPO&INPIT |
