发明名称 DEVICE FOR LEVELING NOODLE CLUSTER
摘要 <P>PROBLEM TO BE SOLVED: To provide a device for leveling a noodle cluster for unfolding and also leveling the upper surface of the noodle cluster placed in a molding frame before its frying process in the production processes of an instant noodle. <P>SOLUTION: This device arranged on a molding frame-conveyer 1 between a cutting and putting-in machine and a fryer in the production line of the instant noodle and used for unfolding and also leveling the upper surface of the noodle cluster in the molding frame 3 preceding to the frying is provided by equipping a transferring frame 4 reciprocating in a prescribed section in parallel to the progressing direction of the molding frame-conveyer 1 and also performing lifting up and down movements at the end of the reciprocating movements, a means 11 driving to reciprocate the transferring frame 4 within the above prescribed section, a means 15 driving to lift up and down the transferring frame 4 at the end of the above reciprocating movements, rotary nozzles 5 arranged as capable of revolving at the transferring frame 4 as corresponding to the position of the molding frame 3 of the molding frame conveyer 1, means 35 to 37, 40 arranged at the transferring frame 4 and driving to revolve the rotary nozzles 5, and a means for supplying air for ejection to each of the rotary nozzles 5. <P>COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009112284(A) 申请公布日期 2009.05.28
申请号 JP20070291952 申请日期 2007.11.09
申请人 TOKYO MENKI CO LTD 发明人 MARUFUJI KENJI
分类号 A23L7/109 主分类号 A23L7/109
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