| 摘要 |
PROBLEM TO BE SOLVED: To provide a polishing slurry capable of preventing the occurrence of scratches on the surface of an object to be polished, enabling excellent polishing speed during polishing, less producing blisters of slurry during polishing, and useful for CMP. SOLUTION: The polishing slurry contains at least one type of inorganic abrasive grains I selected from a group comprising an aluminum oxide, titanium oxide, a zirconium oxide, a germanium oxide, a silicone oxide, a cerium oxide, and a tantalum oxide and at least one type of an unsaturated fatty acid salt II selected from a group comprising an alkali metal salt of an unsaturated fatty acid and an alkaline earth metal salt of an unsaturated fatty acid. In this case, the content of the unsaturated fatty acid salt II in the polishing slurry is 0.00001-0.005 mass%. COPYRIGHT: (C)2009,JPO&INPIT |
