WIRING BOARD, METHOD FOR MANUFACTURING SAME AND SEMICONDUCTOR DEVICE

摘要

A wiring board which includes a product portion configured with at least one layer of electrically insulating base, a wiring pattern formed on the surface or inner portion of the electrically insulating base, and a wiring protection layer which is formed on the surface of the board and has an opening. Warping over the entire wiring board can be reduced since this wiring board has a warp-correcting portion warped in a direction different from that of the product portion.