PHOTORESIST COMPOSITIONS AND PROCESS FOR MULTIPLE EXPOSURES WITH MULTIPLE LAYER PHOTORESIST SYSTEMS

摘要

A photoresist composition and methods using the photoresist composition in multiple exposure/multiple layer processes. The photoresist composition includes a polymer comprising repeat units having a hydroxyl moiety; a photoacid generator; and a solvent. The polymer when formed on a substrate is substantially insoluble to the solvent after heating to a temperature of about 150 °C or greater. One method includes forming a first photoresist layer (120) on a substrate (110), patternwise exposing the first photoresist layer, forming a second non-photoresist layer on the substrate and patterned first photoresist layer (120A). Another method includes forming a first photoresist layer (120) on a substrate (110), patternwise exposing the first photoresist layer, forming a second photoresist layer (130) on the substrate and patterned first photoresist layer (120A) and patternwise exposing the second photoresist layer.