发明名称 ON-DIE TERMINATION DEVICE AND SEMICONDUCTOR MEMORY DEVICE INCLUDING THE SAME
摘要 PROBLEM TO BE SOLVED: To reduce the size of an on-die termination device and a chip applying the on-die termination device thereto, by reducing the number of lines for transferring calibration codes. SOLUTION: An on-die termination device includes: a calibration circuit 410 configured to generate calibration codes for determining a termination resistance; a counting circuit 420 configured to generate counting codes increasing with time; a transferring circuit 430 configured to sequentially transfer the calibration codes in response to the counting codes; a receiving circuit 440 configured to sequentially receive the calibration codes from the transferring circuit 430 in response to the counting codes; and a termination resistance circuit 450 configured to perform impedance matching using a resistance determined according to the calibration codes from the receiving circuit 440. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009118480(A) 申请公布日期 2009.05.28
申请号 JP20080281041 申请日期 2008.10.31
申请人 HYNIX SEMICONDUCTOR INC 发明人 KIM KI-HO;JANG JI-EUN
分类号 H03K19/0175;G11C11/4093 主分类号 H03K19/0175
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