| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive sheet for inspection that permits an electric conduction test even in a state where a semiconductor wafer or a semiconductor chip formed by dicing a semiconductor wafer is laminated thereon and can prevent deformation (warpage) or breakage of a semiconductor wafer, or generation of flaws or scratches on the back surface in the inspection, and a method of manufacturing a semiconductor device using the same. SOLUTION: The adhesive sheet for inspection comprises a support and, sequentially laminated thereon, a substrate film and an adhesive layer, where the support has a tensile modulus at 23°C of at most 500 MPa; the substrate film is composed of an electroconductive fiber; and an electric conduction path is formed between the adhesive layer and the substrate film. COPYRIGHT: (C)2009,JPO&INPIT |
