THERMALLY CONDUCTIVE GRAPHITE REINFORCED ALLOYS

摘要

Composite bodies and methods for producing such composite bodies having discontinuous graphite preforms and at least one silicon-bearing metal alloy infiltrant are described. The metal alloy is preferably comprised of aluminum, copper, or magnesium, or combinations thereof. Certain embodiments provide at least one aluminum alloy having from about 5% silicon to about 30% silicon and from about 11% to about 13% silicon, as an alloying element. Certain embodiments provide an aluminum-silicon eutectic composition having about 12.5% silicon. Embodiments of the invention provide composite materials be "tuned" to more closely match thermal expansion characteristics of a number of semiconductor and integrated circuit materials such as, but not limited to, silicon, alumina, aluminum nitride, gallium nitride, and gallium arsenide while also providing high thermal conductivity. Embodiments of the present invention are especially suited for use as a heat sink, a heat spreader, or both.