| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a device having improved light transmissive property by bonding SiO<SB>2</SB>material substrates at room temperature with practical bonding strength, and to provide a manufacturing method of the device. <P>SOLUTION: The device includes a first substrate 11 employing silicon dioxide as a main constituent, a second substrate 12 employing silicon, a compound semiconductor, silicon dioxide or fluoride as a main constituent, and a bonding intermediate layer 28 arranged between the first substrate 11 and the second substrate 12. The first substrate 11 is bonded to the second substrate 12 via the bonding intermediate layer 28 at room temperature. In this case, a selected material for the bonding intermediate layer 28 is an oxide, fluoride or nitride material having light transmissive property, different from the main constituent of the first substrate 11 and from the main constituent of the second substrate 12. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
