| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive sheet for inspection that permits an electric conduction test even in a state where a semiconductor wafer or a semiconductor chip formed by dicing a semiconductor wafer is laminated thereon and can prevent deformation (warpage) or breakage of a semiconductor wafer, or generation of flaws or scratches on the back surface in the inspection, and a method of manufacturing a semiconductor device using the same. SOLUTION: The adhesive sheet for inspection comprises a substrate film and an adhesive layer formed thereon, where the substrate film and the adhesive layer are electroconductive and an electric conduction path is formed between them. COPYRIGHT: (C)2009,JPO&INPIT |
