CLUSTER TYPE SEMICONDUCTOR PROCESSING APPARATUS

摘要

PROBLEM TO BE SOLVED: To provide a cluster semiconductor processing apparatus of which throughput is increased, footprint is reduced and maintenance performance is improved. SOLUTION: A cluster semiconductor processing apparatus includes wafer handling chambers 5 and 6 having a polygonal base including multiple sides for wafer processing chambers and two adjacent sides for wafer loading/unloading chambers as viewed in a direction of an axis of the wafer handling chambers 5 and 6. An angle A between two adjacent sides of the multiple sides for wafer processing chambers is greater than an angle B which is calculated by dividing 360°by the number of the total sides consisting of the multiple sides for wafer processing chambers and the two adjacent sides for wafer loading/unloading chambers. COPYRIGHT: (C)2009,JPO&INPIT