MOUNTING STRUCTURE, AND MANUFACTURING METHOD THEREOF

摘要

PROBLEM TO BE SOLVED: To provide a mounting structure wherein a joint material portion is hardly broken by thermal stress in product environment. SOLUTION: A protruded electrode (4) of an electronic component is embedded and electrically connected into a conductor wire (2) provided on a base material (1). The conductor wire has at least a porous portion (2a) around the protruded electrode. COPYRIGHT: (C)2009,JPO&INPIT