INK FOR CONDUCTIVE FILM FORMATION AND PROCESS FOR PRODUCING PRINTED WIRING BOARD

摘要

An ink for conductive film formation that forms a conductive film excelling in adherence to an electric insulator layer containing a polyimide; and a process for producing a printed wiring board, in which a printed wiring board having a conductive film excelling in adherence to an electric insulator layer containing a polyimide can be produced through less steps. The ink for conductive film formation is one comprising a water insoluble organic solvent of 150° to 350°C boiling point under a barometric pressure of 0.1 MPa, metal microparticles and/or metal hydride microparticles dispersed in the organic solvent and an amino compound of 10 to 190 mgKOH/g amine value as prescribed in JIS K7237. The ink is applied onto the surface of electric insulator layer (12) and formed into a coating film, and the coating film is fired into conductive film (14).