| 摘要 |
<P>PROBLEM TO BE SOLVED: To eliminate the defective secondary junction caused by the deposition of additive element oxides in a high-purity gold bonding wire. <P>SOLUTION: The bonding wire is made of an Au alloy composed of, by mass, 5-100 ppm Mg, 5-20 ppm In, 15-20 ppm Al, 5-20 ppm Yb and the balance ≥99.995% Au and further, contains 5-20 ppm Ca and one or more kinds among 5-20 ppm La, 5-20 ppm Lu, 5-100 ppm Sn and 5-100 ppm Sr, or further, may contain 0.01-1.2% Pd. Since additional element oxide deposited on the tip part of a capillary developed at the ball-forming time and at the first bonding time with fine electric discharge, is not accumulated by transfer to the wire at the secondary bonding time, the bonding wire containing these trace elements has no trouble caused by these accumulated pollutants. <P>COPYRIGHT: (C)2009,JPO&INPIT |
