| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electronic component that is miniaturized and improves electrical characteristics. <P>SOLUTION: The electronic component 121 has a plurality of bump electrodes 12 on an active surface having a plurality of external connection terminals 16. In the bump electrodes 12, a conductive film 14 is provided on the surface of an inner resin 13 with the inner resin 13 formed on the active surface as a core. The inner resin 13 is formed nearly in a semicylindrical shape while orthogonally crossing a cross section and is extended with the cross section orthogonally crossing the active surface nearly in a semicircular, semielliptical, or trapezoidal shape. At least one of the external connection terminals 16 makes continuity with a plurality of conductive films 14. <P>COPYRIGHT: (C)2009,JPO&INPIT |
