发明名称 DESIGNING METHOD OF DIE, SIMULATING METHOD OF SHAPING MULTI-LAYERED FILM, AND SIMULATING SYSTEM OF SHAPING MULTI-LAYERED FILM
摘要 PROBLEM TO BE SOLVED: To provide a designing method of a die, a simulating method of shaping a multi-layered film and a simulating system of shaping a multi-layered film each capable of manufacturing the multi-layered film showing a uniform distribution of a thickness ratio in a breadthwise direction of a plurality of layers. SOLUTION: The designing method of the die includes the process of obtaining shaping conditions of the multi-layered film including a designed thickness ratio of the layers of the multi-layered film to be shaped and a supply amount of a material of each layer in a unit time, the process of setting a shape of the die, the process of calculating a flow velocity distribution of each layer at a position just before the confluence by using a constitution equation showing a relation between a viscosity and a shear rate of each layer, the process of calculating the flow velocity distribution of each layer at a discharge opening of the die to calculate the thickness ratio distribution in the breadthwise direction of a plurality of the layers, and the process of detecting a gap between the calculated thickness ratio distribution in the breadthwise direction of a plurality of the layers at the discharge opening of the die and the designed thickness ratio to correct the set shape of a flow channel of the die when the gap is as large as or larger than a predetermined value or establish the set shape of the die as the designed shape of the die when the gap is smaller than the predetermined value. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009113406(A) 申请公布日期 2009.05.28
申请号 JP20070290759 申请日期 2007.11.08
申请人 MITSUI CHEMICALS INC 发明人 ISAKI TAKEHARU;MORITA SATOSHI
分类号 B29C47/08;B29C47/14 主分类号 B29C47/08
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