| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate holder which can fit a substrate to be treated therein without a lift when fitting the substrate to be treated to a substrate-supporting tool of the substrate holder and thereby causes no crack and chip on an outer circumferential edge of the substrate to be treated, and to provide a film-forming apparatus provided with the substrate holder. SOLUTION: The substrate holder 21 includes: an inner flange 22c which projects inward at a lower end of a cylinder 22a; and the substrate-supporting tool 22 for supporting the outer circumferential edge of a semiconductor substrate 4 which has been fitted in the cylinder 22a, with the inner flange 22c. The inner flange 22c has a clearance groove 23 formed therein for the outer circumferential edge of the semiconductor substrate 4. A vapor-deposition apparatus 20 is provided with the substrate holder 21. COPYRIGHT: (C)2009,JPO&INPIT
|
