| 摘要 |
PROBLEM TO BE SOLVED: To improve storage stability of a base resin component and workability and to sufficiently suppress sedimentation of components during curing. SOLUTION: The epoxy resin composition for casting consists of a base resin component and a curing agent component. The base resin component comprises (A) an epoxy resin, (B) an inorganic filler containing (B1) crystal silica with a mean particle size of 9-13μm, (B2) crystal silica with a mean particle size of 6-8μm, and (B3) aluminum hydroxide with a mean particle size of 0.5-1.5μm, and (C) a salt of unsaturated polyaminoamide and acid polyester. The curing agent component comprises (D) an acid anhydride curing agent and (E) a curing accelerator. A mass ratio (B1):(B2) between the components (B1) and (B2) is 40:60 to 60:40, the components (B1) and (B2) is 80-95 mass% of the whole of the component (B), the component (B3) is 5-20 mass% of the whole of the component (B), and the component (C) is 0.3-2.0 mass% of the whole of the component (B). The electric/electronic component device is producing by casting the composition. COPYRIGHT: (C)2009,JPO&INPIT
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