发明名称 |
Epoxy Resin Composition and Die Bonding Material Comprising the Composition |
摘要 |
A composition comprising (A) an epoxy resin, (B) an epoxy resin curing agent in such an amount that an equivalent ratio of a functional group of the epoxy resin curing agent (B) to the epoxy group of the epoxy resin (A) ranges from 0.8 to 1.25, (C) thermoplastic resin particles which are solid at 25° C. in an amount of from 3 to 60 parts by weight per total 100 parts by weight of the epoxy resin (A) and the epoxy resin curing agent (B), and (D) an epoxy resin curing promoter in an amount of from 0.1 to 10 parts by weight per total 100 parts by weight of the epoxy resin (A) and the epoxy resin curing agent (B). The composition is stable in B-stage and forms a curing product with no void. |
申请公布号 |
US2009133833(A1) |
申请公布日期 |
2009.05.28 |
申请号 |
US20060991136 |
申请日期 |
2006.08.23 |
申请人 |
SHIN-ETSU CHEMICAL CO., LTD. |
发明人 |
HONDA TSUYOSHI;TAKENAKA HIROYUKI |
分类号 |
C09J163/00;C08L63/00;C08L67/06;C08L71/00;C08L83/05 |
主分类号 |
C09J163/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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