| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a multi-chip with optical coupling means. <P>SOLUTION: Two or more silicon chips 210, 230 laminated in parallel, two or more optical element arrays 220, 240, which are bonded opposite to each other, respectively, on the side face of each silicon chip and are equipped with a light emitting element and/or a light receiving element, respectively, and wires 228, 238, which connect the silicon chip and the optical element array mounted on the side face of the silicon chip, are provided. The optical element array is a multi-chip for transceiving an optical signal between the corresponding optical elements in different layers formed in multi-layer. <P>COPYRIGHT: (C)2009,JPO&INPIT |
