| 摘要 |
<P>PROBLEM TO BE SOLVED: To arrange two antennas on a semiconductor chip. <P>SOLUTION: The semiconductor device includes a first loop antenna 30 and a second loop antenna 40; the first loop antenna 30 is formed on an insulating layer, including a semiconductor chip 100 including a power circuit section 120 and a transmission/reception circuit section 110, an insulating layer 10 formed on the semiconductor chip, loop-like wiring of which one end is connected to a first terminal T1 and the other end is connected to a second terminal T2, and a first capacitor C1 connected between the first and second terminals; the second loop antenna 40 is arranged inside the first loop antenna, and is formed on an insulating layer, including loop-like wiring of which one end is connected to a third terminal T3 and the other end is connected to a fourth terminal T4, and a second capacitor C2 connected between the third and fourth connectors; and in the semiconductor device, the first terminal T1 and the second terminal T2 are connected to the power circuit section 120, and the third terminal T3 and the fourth terminal T4 are connected to the transmission/reception circuit section 110. <P>COPYRIGHT: (C)2009,JPO&INPIT |
