发明名称 RESIN SEALING MOLDING METHOD FOR ELECTRONIC COMPONENT, AND DEVICE THEREFOR
摘要 PROBLEM TO BE SOLVED: To stably set the vacuum degree of an air shielding space part formed at a mold assembly 110. SOLUTION: To a cavity member 603 having a cavity 114 for resin molding and a resin passage 115 for resin transfer provided in a mold assembly 110 (upper mold 112), an elastic air shielding member 604 (elastic pressing mechanism 605) which elastically slides is equipped, further, the mold assembly 110 is clamped under a required clamping pressure, the tip face 604a of the elastic air shielding member 604 and the mold face 111a of a lower mold 111 are abutted under a required pressing force, also the tip face 140a of a pot block 140 having a pot 141 is joined to the side face 110a of the mold assembly, thus a space part in the mold at least having the pot 141, the cavity 114 and the resin passage 115 is made into an air shielding state, so as to form an air shielding space part 501, and further, evacuation is performed from the air shielding space part 501, thus the vacuum degree of the air shielding space part 501 is set to the required one. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009113306(A) 申请公布日期 2009.05.28
申请号 JP20070288042 申请日期 2007.11.06
申请人 TOWA CORP 发明人 TAKASE SHINJI;TAMURA KOJI;KAWAMOTO YOSHIHISA
分类号 B29C45/14;B29C45/02;B29C45/34;B29L31/34;H01L21/56 主分类号 B29C45/14
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