| 摘要 |
PROBLEM TO BE SOLVED: To provide a workpiece holding apparatus capable of preventing residual charges and dielectric breakdown without any particle generation and without shortening the lifetime of the apparatus. SOLUTION: The workpiece holding apparatus 1 is a chuck for sucking and holding a wafer W and has a base 2 and a suction film 3. The base 2 has a cooling water channel 20 and a lift pin 21. The suction film 3 is stuck to a surface 2a of the base 2 via an adhesive 4. Such a suction film 3 has a surface structure and flexibility capable of sucking the wafer W by van der Waals' force when brought into contact with the wafer W. Preferably, the suction film 3 is formed by silicone rubber. COPYRIGHT: (C)2009,JPO&INPIT
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