发明名称 |
SEMICONDUCTOR LIGHT EMITTING DEVICE, LIGHTING MODULE, LIGHTING APPARATUS, DISPLAY ELEMENT, AND MANUFACTURING METHOD FOR SEMICONDUCTOR LIGHT EMITTING DEVICE |
摘要 |
In an LED array chip (2), LEDs (6) are connected together in series by a bridging wire (30). The LEDs (6) each have a semiconductor multilayer structure (8-18) including a light emitting layer (14). Here, the semiconductor multilayer structure (8-18) is epitaxially grown on a front surface of an SiC substrate (4). A phosphor film (48) covers the LEDs (6). Two power supply terminals (36 and 38), which are electrically independent from each other, are formed on a back surface of the SiC substrate (4). The power supply terminal (36) is connected to a cathode electrode (32) of an LED (6a) at a lower potential end by a bridging wire (40) and a plated-through hole (42). The power supply terminal (38) is connected to an anode electrode (34) of an LED (6d) at a higher potential end by a bridging wire (44) and a plated-through hole (46).
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申请公布号 |
US2009134420(A1) |
申请公布日期 |
2009.05.28 |
申请号 |
US20090362252 |
申请日期 |
2009.01.29 |
申请人 |
PANASONIC CORPORATION |
发明人 |
NAGAI HIDEO |
分类号 |
H01L33/06;F21K7/00;H01J1/62;H01L25/075;H01L27/15;H01L33/08;H01L33/10;H01L33/32;H01L33/34;H01L33/38;H01L33/42;H01L33/50;H01L33/56;H01L33/58;H01L33/60;H01L51/52;H01L51/56 |
主分类号 |
H01L33/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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