| 摘要 |
An electrolytic processing method makes it possible to preferentially process a diffusion barrier layer while suppressing processing of an interconnect metal, thereby enabling omission of CMP or a lowering of processing pressure in CMP. The electrolytic processing method comprises: bringing a surface of a substrate (W) into contact with an electrolytic solution (48) comprising an organic solvent, such as propylene carbonate, and an electrolyte, such as lithium hexafluorophosphate, dissolved into the organic solvent, and optionally an inhibitor composed of a heterocyclic compound; and applying an electric potential, for example, a positive electric potential which is controlled at a value less than the decomposition voltage of the organic solvent, to the surface of the substrate (W) to carry out electrolytic processing of the substrate surface.
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